Semiconductor processing sheet

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10636691
APP PUB NO 20170278739A1
SERIAL NO

15466369

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

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Patent Owner(s)

  • LINTEC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akutsu, Takashi Saitama, JP 77 1205
Nishida, Takuo Munich, DE 19 32

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