Composite Particles, Method of Refining and Use Thereof
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United States of America Patent
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Issued Date -
Oct 5, 2017
app pub date -
Mar 17, 2017
filing date -
Mar 31, 2016
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Abstract
Composite particles with lower mean particle size and smaller size distribution are obtained through refining treatments. The refined composite particles, such as ceria coated silica particles are used in Chemical Mechanical Planarization (CMP) compositions to offer higher removal rate; very low within wafer (WWNU) for removal rate, low dishing and low defects for polishing oxide films.
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