SUBSTRATE TREATING DEVICE AND SUBSTRATE TREATING METHOD

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United States of America Patent

SERIAL NO

15474107

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Abstract

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According to the embodiment, a substrate treating device 1 that rotates and washes a substrate, the device includes a spinning holding mechanism for holding a substrate, a treatment liquid supply nozzle for supplying a treatment liquid to the substrate, a shielding plate that is arranged opposite to the substrate held by the spinning holding mechanism and that moves in a contact/separate direction with respect to the substrate, a shielding plate rotating mechanism for rotating the shielding plate, and a control device for controlling the shielding plate rotating mechanism to rotate the shielding plate without moving the shielding plate from a standby position when the treatment liquid is supplied from the treatment liquid supply nozzle. It is possible to prevent contamination of a substrate during the treatment process.

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Patent Owner(s)

Patent OwnerAddress
SHIBAURA MECHATRONICS CORPORATION5-1 KASAMA 2-CHOME SAKAE-KU YOKOHAMA-SHI KANAGAWA 247-8610

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KOBAYASHI, Nobuo Yokohama-shi, JP 144 1838
SASAHIRA, Konosuke Yokohama-shi, JP 1 1
YAMAZAKI, Katsuhiro Yokohama-shi, JP 15 459

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