Electronic device provided with a thermal dissipation member
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United States of America Patent
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Jun 12, 2018
Issued Date -
N/A
app pub date -
Mar 7, 2017
filing date -
Mar 30, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device includes a support and a component in the form of an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face. A block is provided for at least partially encapsulating the component above the front face of the support. The device also includes at least one thermal dissipation member having a flexible sheet having at least two portions folded onto one another while forming at least one fold between them, these portions facing one another at least partly.
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