INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED EMI SHIELD
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United States of America Patent
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Issued Date -
Oct 5, 2017
app pub date -
Apr 1, 2016
filing date -
Apr 1, 2016
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Abstract
Apparatus and methods are provided for an integrated circuit package that includes an integrated EMI shield. In an example, an integrated circuit package can include an integrated circuit mounted to a substrate via connections on the bottom surface of the integrated circuit, a conductive fence surrounding side surfaces of the integrated circuit, a conductive film coupled to the conductive fence, the film located above a top surface of the integrated circuit and coextensive with a footprint defined by the conductive fence.
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