Semiconductor package structure and method for manufacturing the same

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United States of America Patent

PATENT NO 9853011
APP PUB NO 20170287871A1
SERIAL NO

15083527

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Abstract

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A semiconductor package structure includes a conductive structure, a semiconductor element disposed on and electrically connected to the conductive structure, a supporting structure, an encapsulant, and a metal layer. The supporting structure is disposed on the conductive structure and surrounds the semiconductor element. The encapsulant covers the semiconductor element. The metal layer is disposed on or embedded in the encapsulant.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Wen-Long Kaohsiung, TW 90 196

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