Light emitting device package
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United States of America Patent
Stats
-
Nov 12, 2019
Grant Date -
Oct 5, 2017
app pub date -
Jun 5, 2017
filing date -
Dec 19, 2013
priority date (Note) -
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Abstract
A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- LUMILEDS LLC
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
De, Jong Boudewijn Ruben | Eindhoven, NL | 9 | 18 |
Dijkstra, Paul | Eindhoven, NL | 17 | 179 |
Donker, Marcus Franciscus | Wijchen, NL | 5 | 6 |
Oberndorff, Pascal Johannes Theodorus Lambertus | Eindhoven, NL | 2 | 4 |
Reints, Bok Aernout | Eindhoven, NL | 2 | 4 |
Zhang, Lu Fei | Eindhoven, NL | 2 | 4 |
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