Importance

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Abstract

Techniques and mechanisms for exchanging image data via a three-wire data channel of an interconnect, at least a portion of which is disposed in or on a substrate of a printed circuit board. In an embodiment, three data signals are concurrently exchanged in parallel, each via a different respective trace portion of the data channel. The substrate has disposed therein or thereon three filter structures each to perform filtering of a different respective one of the three signals. The filter structures each include a respective sequence of corrugations to increase a stray capacitance provided by a substrate material. In another embodiment, the interconnect is compatible with a Mobile Industry Processor Interface (MIPI) camera physical layer interface (C-PHY) standard.

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First Claim