Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet
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United States of America Patent
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May 19, 2020
Grant Date -
Oct 5, 2017
app pub date -
Mar 23, 2017
filing date -
Mar 30, 2016
priority date (Note) -
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Abstract
A thin film component sheet includes: a conducting interconnection layer formed of a conductor; an insulating layer that is laminated on the conducting interconnection layer and is formed of an insulating material; and a plurality of thin film electronic components, each of which has a pair of first and second electrode layers and a dielectric layer provided between the first and second electrode layers, and which are arranged to be separated on the insulating layer. In a state in which a main surface of the first electrode layer in each of the plurality of thin film electronic components is exposed to an outside on a main surface of one side of the thin film component sheet, a flat surface of the main surface of the thin film component sheet is formed.
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