ELECTROPHORETIC DEPOSITION FLUID, METAL CORE SUBSTRATE, AND METHOD FOR FABRICATING THE METAL CORE SUBSTRATE

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United States of America Patent

SERIAL NO

15511470

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Abstract

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The invention is directed to a metal core substrate having high thermal conductivity and high electrical insulating properties; an electrophoretic deposition fluid for use in fabrication of the metal core substrate; and a method for fabricating the metal core substrate. The electrophoretic deposition fluid is used during electrophoretic deposition, and contains ceramic particles for coating a metal substrate, and an organopolysiloxane composition which binds the ceramic particles.

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Patent Owner(s)

Patent OwnerAddress
MIE UNIVERSITY1577 KURIMAMACHIYA-CHO TSU-SHI 514-8507

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AOKI, Yusuke Mie, JP 46 157
KANO, Mikihito Mie, JP 2 4
KASANO, Kazuhiko Mie, JP 3 5

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