POLISHING COMPOSITION, METHOD FOR MANUFACTURING SAME, AND POLISHING METHOD

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United States of America Patent

SERIAL NO

15514172

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is provided a polishing composition capable of polishing a polishing object including elemental silicon, a silicon compound, metals and the like, especially including tungsten, at a high polishing rate. The polishing composition includes: colloidal silica with organic acid immobilized to a surface thereof; hydrogen peroxide; and salt, the salt being at least one of ammonium nitrate and ammonium sulfate.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDNISHIKASUGAI-GUN AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SAKABE, Koichi Aichi, JP 13 46
SATO, Takeki Aichi, JP 8 26

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