Systems and Methods for Producing Tapered Resistive Cards and Capacitive Sheets
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United States of America Patent
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Issued Date -
Oct 12, 2017
app pub date -
Apr 11, 2016
filing date -
Apr 11, 2016
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Abstract
In certain embodiments, a method comprises ablating, by a laser set to a first power level, a first area of a polyimide base substrate and forming, by ablating the first area of the polyimide base substrate, a first carbonaceous material film comprising a first specific resistive value. The method further comprises ablating, by the laser set to a second power level, a second area of the polyimide base substrate and forming, by ablating the second area of the polyimide base substrate, a second carbonaceous material film comprising a second specific resistive value. A tapered resistive material is produced by forming the first carbonaceous material film comprising the first specific resistive value and the second carbonaceous material film comprising the second specific resistive value.
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