Semiconductor package device and method of manufacturing the same
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United States of America Patent
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Sep 4, 2018
Grant Date -
Oct 12, 2017
app pub date -
Jan 10, 2017
filing date -
Apr 8, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.
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