Wired circuit board including a conductive pattern having a wire and a dummy portion
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United States of America Patent
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Jun 16, 2020
Grant Date -
Oct 12, 2017
app pub date -
Apr 4, 2017
filing date -
Apr 7, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
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