MODULAR COOLING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170295667A1
SERIAL NO

15511983

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPHOUSTON, TX8793

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