MODULAR COOLING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170295667A1
SERIAL NO

15511983

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPHOUSTON, TX9302

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CADER, Tahir Liberty Lake, US 72 297
FRANZ, John P Houston, US 88 435
GARDAY, Douglas Kent Mesa, US 3 1
MOORE, David Allen Tomball, US 8 83
Vinson, Wade D Magnolia, US 58 635

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (5)
* 2005/0248,922 COOLING ASSEMBLY FOR ELECTRONICS DRAWER USING PASSIVE FLUID LOOP AND AIR-COOLED COVER 23 2004
* 8120300 Fault tolerant cooling in a redundant power system 1 2008
* 2010/0164,427 APPARATUS, SYSTEM, AND METHOD FOR FAULT TOLERANT COOLING IN A REDUNDANT POWER SYSTEM 0 2008
* 2011/0013,359 Low Cost Liquid Cooling 5 2009
* 2012/0026,691 APPARATUS AND METHOD FOR FACILITATING DISSIPATION OF HEAT FROM A LIQUID-COOLED ELECTRONICS RACK 15 2010
 
AMERICAN POWER CONVERSION CORPORATION (1)
* 2008/0198,549 COOLING SYSTEM AND METHOD 74 2008
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
* 2005/0241,803 Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation 8 2004
 
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP (2)
* 2004/0264,124 Cooling system for computer systems 31 2003
* 2006/0161,311 Cooling assist module 20 2005
 
COOLIT SYSTEMS INC. (1)
* 2008/0043,433 Air cooled computer chip 0 2006
 
GREEN REVOLUTION COOLING, INC. (1)
* 2014/0301,037 LIQUID COOLANT-SUBMERSIBLE NODE 4 2014
 
ASETEK DANMARK A/S (1)
* 2011/0303,394 LIQUID COOLING SYSTEM FOR A SERVER 7 2011
 
AMAZON TECHNOLOGIES, INC. (1)
* 2014/0063,730 MULTI-MODE COOLING SYSTEM AND METHOD WITH EVAPORATIVE COOLING 3 2013
 
HITACHI, LTD. (3)
* 2009/0154,104 Cooling Device and Electronic Apparatus Using the Same 9 2008
* 2010/0073,866 COOLING DEVICE AND ELECTRONIC EQUIPMENT INCLUDING COOLING DEVICE 8 2009
* 2011/0279,976 LOCAL COOLING UNIT AND COOLING SYSTEM 2 2011
 
DELL PRODUCTS L.P. (1)
* 2012/0176,745 Dual Mode Portable Information Handling System Cooling 3 2011
 
INVENTEC (PUDONG) TECHNOLOGY CORPORATION (1)
* 2014/0085,808 SERVER SYSTEM AND SERVER THEREOF 4 2013
 
MSI COMPUTER (SHENZHEN) CO., LTD. (1)
* 2015/0070,844 LIQUID-COOLING MODULE AND ELECTRONIC DEVICE USING THE SAME 0 2013
 
INTEL CORPORATION (1)
* 2005/0141,200 Backside cooling apparatus for modular platforms 0 2003
 
KABUSHIKI KAISHA TOSHIBA (1)
* 2014/0211,531 LIQUID COOLING TYPE POWER CONVERSION APPARATUS AND RAILWAY VEHICLE 2 2014
 
CATERPILLAR INC. (1)
* 2015/0173,238 CONFIGURABLE POWER CONVERTER PACKAGE 2 2013
 
DELTA ELECTRONICS, INC. (1)
* 2006/0227,504 Heat-dissipating module of electronic device 7 2005
 
MAXELL, LTD. (2)
* 2004/0221,604 Liquid cooling system for a rack-mount server system 79 2004
* 2005/0180,105 Redundant liquid cooling system and electronic apparatus having the same therein 4 2004
* Cited By Examiner

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