Device and method for inspecting position of probe, and semiconductor evaluation apparatus
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United States of America Patent
Stats
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Jul 23, 2019
Grant Date -
Oct 19, 2017
app pub date -
Dec 12, 2016
filing date -
Apr 19, 2016
priority date (Note) -
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Abstract
Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- MITSUBISHI ELECTRIC CORPORATION
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Noguchi, Takaya | Tokyo, JP | 21 | 39 |
Okada, Akira | Tokyo, JP | 169 | 2437 |
Takesako, Norihiro | Tokyo, JP | 10 | 19 |
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