LEADFRAME SUBSTRATE WITH ISOLATOR INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Jul 5, 2017
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Mar 7, 2014
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Abstract
The leadframe substrate includes an isolator incorporated with metal leads by a compound layer. The metal leads are disposed about sidewalls of the isolator and provide horizontal and vertical routing for a semiconductor device to be assembled on the isolator. The compound layer covers the sidewalls of the isolator and fills in spaces between the metal leads, and provides robust mechanical bonds between the metal leads and the isolator.
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