Communication jack having a dielectric film between plug interface contacts
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United States of America Patent
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Aug 14, 2018
Grant Date -
Oct 19, 2017
app pub date -
Mar 27, 2017
filing date -
Apr 13, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the present invention relate to designs for network jacks which can be used for cable connectivity. In an embodiment, the present invention is an RJ45 jack that utilizes a thin dielectric film between two layers of PICs that provide crosstalk compensation by way of their geometry. Compensation is achieved by way of capacitor plates which sandwich a thin dielectric film. This allows for the layers of PICs to be in close proximity and achieve higher coupling where desired, allowing a greater amount of compensation to occur close to the plug/jack contact point. This can have the effect of moving compensation closer to the plug/jack contact point, which in turn may reduce the amount of compensation needed further along the data path.
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