RADIO FREQUENCY SYSTEM-IN-PACKAGE INCLUDING A STACKED SYSTEM-ON-CHIP
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United States of America Patent
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Apr 17, 2017
filing date -
Apr 18, 2016
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Abstract
A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The crystal is disposed between the first die and the substrate. An overmold encloses the crystal and the first die. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal where the second die is disposed on an opposite side of the substrate from the first die and the crystal.
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