Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 19, 2017
app pub date -
Apr 13, 2017
filing date -
Apr 15, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully