Bonding apparatus and bonding method
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United States of America Patent
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Oct 29, 2019
Grant Date -
Oct 26, 2017
app pub date -
Nov 25, 2015
filing date -
Nov 25, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
The bonding apparatus of the present invention is an apparatus that bonds a patch containing a reinforcing fiber to a bonded section of a corner section CR of an object member. The bonding apparatus has s heater mat, a pushing member, a bag member having a decompression port, a mold releasing film, a breather, a heater mat and a sealant. A pushing member has a first cowl plate, a second cowl plate and an elastic pressuring body. A pressuring section of the pushing member has the surface shape corresponding to a corner section design value after the patch is bonded. By protruding from a gap between a first cowl plate and a second cowl plate to a direction of the corner section CR, the patch is pushed to the bonded section and the generation of a wrinkle in the reinforcing fiber can be prevented.
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