FILM FOR INORGANIC SUBSTANCE DEPOSITION, INORGANIC SUBSTANCE DEPOSITED FILM AND USES THEREOF
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United States of America Patent
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Oct 6, 2015
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Oct 7, 2014
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Abstract
A film for inorganic substance deposition, comprising single or multiple resin layers, wherein all of the resin layers contain an ethylene-based polymer (A) having a melt tension (MT), as measured at 190° C., of not more than 5.0 g, and the film satisfies the following requirements: Requirement (1): the amount of a component generated by heating the film under the prescribed conditions is not more than 1.2 μg per milligram of the film; Requirement (2): the amount of a compound containing pentavalent phosphorus, said compound being recovered after washing of a surface of the film under the prescribed conditions, is not more than 9 μg; and Requirement (3): the amount of an oxide of an oligomer of a hexamer to a decamer, said oxide being recovered after washing of a surface of the film under the prescribed conditions, is not more than 1.5 μg.
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