ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD

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United States of America Patent

SERIAL NO

15512598

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An ultrasonic bonding device includes a processing member, a biasing member, a first moving unit and a second moving unit. The biasing member biases a pair of separators to the ultrasonic horn. A first moving unit separates the ultrasonic horn and the biasing member from each other with respect to a transport path of the separators. A second moving unit moves the separators and positions a bonding portion of the separators between the ultrasonic horn and the biasing member. The first moving unit has a coupling cam rotationally driven by a driving unit, a first connecting portion coupling the coupling cam and the processing member, and a second connecting portion coupling the coupling cam and the biasing member, and separating the processing member and the biasing member from each other with respect to the transport path by rotation of the coupling cam.

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Patent Owner(s)

Patent OwnerAddress
ENVISION AESC JAPAN LTD10-1 HIRONODAI 2-CHOME ZAMA-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJISAWA, Shinji Kanagawa, JP 5 112
NAKANO, Takahiro Kanagawa, JP 197 2356
OORUI, Toshiaki Kanagawa, JP 2 8
TAKAKI, Shiro Kanagawa, JP 1 5

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