Rough layer for better anti-stiction deposition

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United States of America Patent

PATENT NO 10273141
APP PUB NO 20170305738A1
SERIAL NO

15138419

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Abstract

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A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chih-Hang Taoyuan, TW 11 17
Liu, Jen-Hao Zhunan Township, TW 35 136
Wang, I-Shi Sanxia Township, TW 32 72

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