Method for producing polyamide resin

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United States of America Patent

PATENT NO 10696789
APP PUB NO 20170306091A1
SERIAL NO

15517464

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Abstract

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Provided is a method for producing a polyamide resin including reacting a dicarboxylic acid component containing sebacic acid in an amount of 50 mol % or more and a diamine component containing xylylenediamine in an amount of 70 mol % or more, wherein the total content of the specific compounds in the sebacic acid is 100 ppm by mass or less.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INC5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8324

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mitadera, Jun Tokyo, JP 59 242
Shinohara, Katsumi Niigata, JP 21 74
Tochihara, Tatsuya Niigata, JP 11 5

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