Structures and Methods for Reliable Packages
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United States of America Patent
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Jul 13, 2017
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Jun 24, 2015
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Abstract
A device and method of forming the device that includes cavities formed in a substrate of a substrate device, the substrate device also including conductive vias formed in the substrate. Chip devices, wafers, and other substrate devices can be mounted to the substrate device. Encapsulation layers and materials may be formed over the substrate device in order to fill the cavities.
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