Method for PECVD overlay improvement

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United States of America Patent

PATENT NO 9947599
SERIAL NO

15492428

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Abstract

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The present disclosure generally relates to a method for performing semiconductor device fabrication, and more particularly, to improvements in lithographic overlay techniques. The method for improved overlay includes depositing a material on a substrate, heating a substrate in a chamber using thermal energy, measuring a local stress pattern of each substrate, wherein measuring the local stress pattern measures an amount of change in a depth of the deposited material on the substrate, plotting a plurality of points on a k map to determine a local stress pattern of the substrate, adjusting the thermal energy applied to the points on the k map, determining a sensitivity value for each of the points on the k map, and applying a correction factor to the applied thermal energy to adjust the local stress pattern.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goto, Yuta Saiki, JP 8 6
Lee, Kwangduk Douglas Redwood City, US 76 2499
Morii, Takashi Wakayama, JP 22 926
Suzuki, Yoichi Funabashi, JP 92 1241
Tsiang, Michael Wenyoung Fremont, US 20 55

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