Semiconductor device having an inductor

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United States of America Patent

PATENT NO 11393782
APP PUB NO 20170309587A1
SERIAL NO

15643906

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device is provided with a semiconductor chip. The semiconductor chip has a semiconductor substrate, an interconnect layer, an inductor and conductive pads (first pads). The interconnect layer is provided on the semiconductor substrate. The interconnect layer includes the inductor. The pads are provided on the interconnect layer. The pads are provided in a region within a circuit forming region of the semiconductor chip, which does not overlap the inductor.

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Patent Owner(s)

  • RENESAS ELECTRONICS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakashiba, Yasutaka Tokyo, JP 332 1900

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