Semiconductor packages
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United States of America Patent
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Mar 5, 2019
Grant Date -
Oct 26, 2017
app pub date -
Sep 29, 2016
filing date -
Apr 26, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A planar dual die package includes a package substrate and first and second semiconductor dice disposed side by side on a first surface of the package substrate. Outer connectors are disposed on a second surface of the package substrate, and the second surface of the package substrate includes a command/address ball region and a data ball region. Each of the first and second semiconductor dice includes die pads disposed in a command/address pad region corresponding to the command/address ball region and in a data pad region corresponding to the data ball region. Each of the first and second semiconductor dice are disposed on the package substrate so that a first direction from the command/address ball region toward the data ball region coincides with a second direction from the command/address pad region toward the data pad region.
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