Manufacturing method of memory device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 12, 2017
Issued Date -
N/A
app pub date -
Aug 24, 2016
filing date -
Apr 20, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a memory device includes providing a semiconductor substrate including a first region and a second region. The method includes forming a lower structure including interconnect lines and an etch stop layer in the second region. The method includes forming a multilayer structure on the lower structure. The method also includes forming a slit trench in the multilayer structure of the first region, a first plug hole exposing the etch stop layer of the second region therethrough, and a second plug hole exposing a portion of the interconnect lines of the second region therethrough.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully