Semiconductor device and method for manufacturing the same

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United States of America Patent

PATENT NO 10032918
SERIAL NO

15488626

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Abstract

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A highly reliable semiconductor device is provided. The semiconductor device includes a first barrier insulating film; a first gate electrode thereover; a first gate insulating film thereover; an oxide semiconductor film thereover; source and drain electrodes over the oxide semiconductor film; a second gate insulating film over the oxide semiconductor film; a second gate electrode over the second gate insulating film; a second barrier insulating film that covers the oxide semiconductor film, the source and the drain electrodes, and the second gate electrode, and is in contact with side surfaces of the oxide semiconductor film and the source and drain electrodes; and a third barrier insulating film thereover. The first to third barrier insulating films are less likely to transmit hydrogen, water, and oxygen than the first and second gate insulating films. The third barrier insulating film is thinner than the second barrier insulating film. The source and drain electrodes each includes a conductive oxide film in contact with the oxide semiconductor film. The conductive oxide film has more oxygen vacancies than the oxide semiconductor film.

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Patent Owner(s)

  • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Endo, Taichi Kanagawa, JP 4 40
Kimura, Hajime Kanagawa, JP 1070 31444
Matsubayashi, Daisuke Kanagawa, JP 137 1707
Ogino, Kiyofumi Kanagawa, JP 46 624
Tokumaru, Ryo Kanagawa, JP 35 306
Yamane, Yasumasa Kanagawa, JP 87 929
Yamazaki, Shunpei Tokyo, JP 7285 226692

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