Semiconductor light emitting devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10008642
SERIAL NO

15364739

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Abstract

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A semiconductor light emitting device may include a semiconductor light emitting diode (LED) chip, a light-transmitting film on the LED chip, and a light-transmitting bonding layer between the light-transmitting film and the semiconductor LED chip. At least one of the light-transmitting film and the light-transmitting bonding layer may include a wavelength conversion material configured to convert light emitted by the semiconductor LED chip into light having a wavelength different from a wavelength of the emitted light. The light-transmitting bonding layer may have a lateral inclined region extending to the lateral surface to form an inclined surface. The semiconductor light emitting device may further include a reflective packaging portion surrounding the light-transmitting bonding layer, covering the first surface such that an electrode of the LED chip is at least partially exposed. The reflective packaging portion may include a reflective material.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Sun Hwan Suwon-si, KR 15 42
Kim, Jin Ha Yongin-si, KR 74 539
Lee, Dong Hoon Suwon-si, KR 463 2368
Lee, Won Joon Seoul, KR 33 228
Seo, Jong Wan Ansan-si, KR 4 19
Woo, Kwang Bok Hanam-si, KR 5 9

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