Stamp for printed circuit process and method of fabricating the same and printed circuit process

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9955584
SERIAL NO

15136999

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A stamp that is configured to be employed in a printed circuit process, a method of fabricating the stamp, and a printed circuit process are provided, and the stamp includes a main structure, a micro-protrusion structure, and a plurality of nano-conical structures. The micro-protrusion structure is located on the main structure. The nano-conical structures are located on the main structure and surround the micro-protrusion structure.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • WINBOND ELECTRONICS CORP.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ho, Yu-Hsuan Taichung, TW 33 35

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Oct 24, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 24, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00