INTERSPINOUS INTEGRATION TYPE IMPLANT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Oct 19, 2015
filing date -
Oct 20, 2014
priority date (Note) -
Published
status (Latency Note)
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
Next PAIR Update Scheduled on [ ] |
Importance
US Family Size
|
Non-US Coverage
|
Abstract
The present invention relates to an interspinous integration type implant. Provided is an interspinous integration type implant which is an implant inserted between an upper spinous process and a lower spinous process and comprises: a spacer to which one end of an upper plate and one end of a lower plate are connected so as to be formed in a “” shape or “U” shape, and which is inserted between spinous processes in order to provide elasticity; an upper spinous process coupling means for tightly coupling the upper plate to the upper spinous process; and a lower spinous process coupling means for tightly coupling the lower plate to the lower spinous process, wherein the upper plate comprises at least one osseointegration hole formed to penetrate the top surface and the bottom surface of the upper plate so as to be moved by being integrated with the upper spinous process, and the lower plate comprises at least one osseointegration hole formed to penetrate the top surface and the bottom surface of the lower plate so as to be moved by being integrated with the lower spinous process. The interspinous integration type implant according to the present invention provides elasticity to the upper spinous process and the lower spinous process, thereby maintaining a space between the upper and lower spinous processes. Also, the interspinous integration type implant moves by being integrated with the upper and lower spinous processes through the osseointegration holes formed at the upper plate and the lower plate, and thus does not damage the spinous processes and has an effect of preventing a separation phenomenon from between the spinous processes. Also, the interspinous integration type implant has an effect of enabling minimally invasive surgery since blades can be rotated and tightened using an instrument after inserting the interspinous integration type implant from the side surface of spinous processes. Furthermore, after inserting the interspinous integration type implant between adjacent spinous processes and tightening the blades at both side surfaces of the spinous processes, a plurality of spikes provided in the blades are tightly embedded on the both side surfaces of the spinous processes, and thus there is an effect that an upper blade and a lower blade are stably coupled to the upper and lower spinous processes. In addition, since the interspinous integration type implant can be inserted between the spinous processes in a state where the upper blade and the lower blade are folded, the blades do not catch on the upper and lower spinous processes during insertion, and thus there is an effect that the interspinous integration type implant can be inserted not only from the rear side of the spinous processes but also from the side surface of the spinous processes.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KIM HYEUN-SUNG | 215 DUNSANBUK-RO SEO-GU DAEJEON 35244 | |
SOLCO BIOMEDICAL CO LTD | 154 SEOTAN-RO SEOTAN-MYEON PYEONGTAEK-SI GYEONGGI-DO PYEONGTAEK-SI 17704 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kim, Hyeun-Sung | Daejeon, KR | 5 | 11 |
Yoon, Hong-Won | Gunpo-si, KR | 6 | 11 |
Cited Art Landscape
- No Cited Art to Display
Patent Citation Ranking
Forward Cite Landscape
- No Forward Cites to Display
Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 2, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 2, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
Legal Events
Matter Detail
Update Public Data Dismiss Edit SaveRenewals Detail
Edit SaveNote
The template below is formatted to ensure compatibility with our system.
Provide tags with | separated like (tags1|tags2).
Maximum length is 128 characters for Customer Application No
Mandatory Fields * - 'MatterType','AppType','Country','Title','SerialNo'.
Acceptable Date Format - 'MM/DD/YYYY'.
Acceptable Filing/App Types -
- Continuation/Divisional
- Original
- Paris Convention
- PCT National
- With Priority
- EP Validation
- Provisional Conversion
- Reissue
- Provisional
- Foreign Extension
Acceptable Status -
- Pending
- Abandoned
- Unfiled
- Expired
- Granted
Acceptable Matter Types -
- Patent
- Utility Model
- Supplemental Protection Certificate
- Design
- Inventor Certificate
- Plant
- Statutory Invention Reg
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Success
E-mail has been sent successfully.
Failure
Some error occured while sending email. Please check e-mail and try again!
PAIR load has been initiated
A preliminary load of cached data will be loaded soon. Current PAIR data will be loaded within twenty four hours.
File History PDF
Thank you for your purchase! The File Wrapper for Patent Number 20170311991 will be available within the next 24 hours.
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully
Important Notes on Latency of Status data
Please note there is up to 60 days of latency in this Status indicator for certain status conditions. You can obtain up-to-date Status indicator readings by ordering PAIR for the file.
An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
An application with the status "Abandoned" is almost always current, but there is a small chance it was recently revived and the status not yet updated.
Important Note on Priority Date data
This priority date is an estimated earliest priority date and is purely an estimation. This date should not be taken as legal conclusion. No representations are made as to the accuracy of the date listed. Please consult a legal professional before relying on this date.
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.