WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOF

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United States of America Patent

SERIAL NO

15651467

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATIONIBARAKI-SHI OSAKA 567-0041

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANAGAWA, Hitoki Osaka, JP 32 210
SAKAKURA, Takatoshi Osaka, JP 15 27
TAKANO, Takahiro Osaka, JP 28 129

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