EMBOSSING DIES HAVING POLYMER LAYERS
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United States of America Patent
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Issued Date -
Nov 9, 2017
app pub date -
Oct 31, 2014
filing date -
Oct 31, 2014
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Abstract
Provided is a method of manufacturing an embossing die. The method comprises mounting a drum or a plate on a support, providing information on a shape of the embossing die, printing a multitude of photopolymer drops forming a photopolymer layer upon the drum or the plate based on the provided information, and curing the printed photopolymer layer.
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