MEMS Package
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United States of America Patent
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Nov 10, 2015
filing date -
Nov 10, 2014
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Abstract
A package includes a base structure, which has an electrically isolating material and/or an electrically conductive contact structure, an electronic component, which is embedded in the base structure or is arranged on the base structure, a microelectromechanical system (MEMS) component, and a cover structure, which is mounted on the base structure for at least partially covering the MEMS component.
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