Polishing composition

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United States of America Patent

PATENT NO 11015098
APP PUB NO 20170321098A1
SERIAL NO

15524989

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Abstract

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The present invention provides a polishing composition for use in polishing a material having a Vickers hardness of 1500 Hv or higher. The polishing composition has an oxidation-reduction potential ORPx mV and the material to be polishing has an oxidation-reduction potential ORPy mV, with their relation satisfying ORPx−ORPy≥100 mV.

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Patent Owner(s)

  • FUJIMI INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Shuhei Kiyosu, JP 60 304
Tomatsu, Masatoshi Kiyosu, JP 4 10

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