STAINLESS STEEL MATERIAL FOR DIFFUSION BONDING

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United States of America Patent

SERIAL NO

15523882

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Abstract

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Provided is a stainless steel material suitable for diffusion bonded moldings in which diffusion bondability has been further improved without being affected by the extent of surface roughness. The present invention is a stainless steel material for diffusion bonding in which the metal structure before diffusion bonding has a multi-phase structure obtained from two or more of a ferrite phase, a martensite phase and an austenite phase, wherein: the mean crystal grain diameter in the multi-phase structure is not more than 20 μm; γmax represented by formula (a) is 10-90; and creep elongation when a 1.0 MPa load is applied at 1000° C. for 0.5 his at least 0.2%. γmax=420C−11.5Si+7Mn+23Ni−11.5Cr−12Mo+9Cu−49Ti−47Nb−52Al+470N+189 . . . Formula (a) The element notations in formula (a) represent the contents (mass %) of the respective elements.

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Patent Owner(s)

Patent OwnerAddress
NISSHIN STEEL CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HORI, Yoshiaki Shunan-shi, Yamaguchi, JP 67 441
IMAKAWA, Kazunari Shunan-shi, Yamaguchi, JP 20 26
KAGEOKA, Kazuyuki Shunan-shi, Yamaguchi, JP 4 5
OKU, Manabu Sakai-shi, Osaka, JP 30 119
SUGAMA, Atsushi Sakai-shi, Osaka, JP 8 22

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