Package with tilted interface between device die and encapsulating material
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United States of America Patent
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Mar 20, 2018
Issued Date -
N/A
app pub date -
Sep 1, 2016
filing date -
May 5, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A method includes forming a polymer layer covering a metal via in a wafer, grooving the wafer to form a trench, wherein the trench extends from a top surface of the polymer layer into the wafer, and performing a die-saw on the wafer to separate the wafer into a plurality of device dies. A kerf passes through the trench. One of the device dies is placed over a carrier. An encapsulating material is dispensed over and around the device die. The method further includes pressing and curing the encapsulating material. After the encapsulating material is cured, a sidewall of the polymer layer is tilted. A planarization is performed on the encapsulating material until the polymer layer and the metal via are exposed. A redistribution line is formed over and electrically coupled to the metal via.
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