Gas-Cooled 3D IC with Wireless Interconnects
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United States of America Patent
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May 5, 2017
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May 5, 2016
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Abstract
A three-dimensional integrated circuit includes two or more stacks of one or more active layers; a gas-cooling layer separating the two or more stacks and a wireless interconnect between the two or more stacks enabling communication between the two or more stacks and system including a gas-cooled three-dimensional integrated circuit having wireless data interconnects is disclosed.
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