SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Nov 9, 2017
app pub date -
May 9, 2016
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May 9, 2016
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Abstract
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and a method of manufacturing thereof, that comprises a substrate including a dielectric layer, at least one conductive trace and conductive bump pad formed on one surface of the dielectric layer, and a protection layer covering the at least one conductive trace and conductive bump pad, the at least one conductive bump pad having one end exposed through the protection layer, and a semiconductor die electrically connected to the conductive bump pad of the substrate.
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