Semiconductor apparatus, solid-state image pickup device, image pickup apparatus, and electronic apparatus
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United States of America Patent
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Dec 11, 2018
Grant Date -
Nov 9, 2017
app pub date -
Dec 2, 2015
filing date -
Dec 16, 2014
priority date (Note) -
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Abstract
The present technology relates to a semiconductor apparatus, a solid-state image pickup device, an image pickup apparatus, and an electronic apparatus capable of improving impedance characteristics while preventing an occurrence of a flare and an interference due to a bonding jig, and achieving downsizing an apparatus. By aligning the heights of a cover glass and a semiconductor device, a distance between the cover glass and the semiconductor device is set to be minimum, and thus it is possible to suppress an occurrence of a flare due to incident light reflected on a side surface of the semiconductor device, and improve the impedance characteristics of the semiconductor device and the semiconductor image pickup device. Further, the interference of the jig used for the semiconductor device is reduced. The present technology can be applied to a CMOS image sensor.
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