INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME
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United States of America Patent
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Issued Date -
Nov 9, 2017
app pub date -
Sep 2, 2016
filing date -
May 6, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.
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