THERMAL INFRARED DETECTOR AND MANUFACTURING METHOD FOR THERMAL INFRARED DETECTOR

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United States of America Patent

SERIAL NO

15345946

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Abstract

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In a thermal infrared detector having trench structures, at least one sensor element is provided between the trench structures, an etching hole through which the sensor element is hollowed out and thereby thermally insulated is provided in a substrate rear surface or on the periphery of a pixel area, and an opening portion is provided below the pixel area.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HARA, Takafumi Tokyo, JP 126 480
KAWANO, Yuji Tokyo, JP 55 1133
KOBAYASHI, Satoi Tokyo, JP 5 2
SUGINO, Takaki Tokyo, JP 13 31

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