Semiconductor device chip package with electronic switching using dedicated ground pin coupled to a virtual ground node
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United States of America Patent
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Nov 6, 2018
Grant Date -
Nov 16, 2017
app pub date -
May 13, 2016
filing date -
May 13, 2016
priority date (Note) -
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Abstract
A semiconductor device is described herein. In accordance with one exemplary embodiment the semiconductor device includes a chip package, which includes at least one semiconductor chip, a dedicated ground pin, a first supply pin for receiving a first supply voltage, a second supply pin for receiving a second supply voltage, and a first input pin. The semiconductor device further includes a first circuit integrated in the semiconductor chip, wherein the first circuit is coupled to the first supply pin and to the ground pin, and a second circuit integrated in the semiconductor chip, wherein the second circuit is coupled to the first supply pin and to a virtual ground node. An electronic switch is configured to connect the virtual ground node with the first input pin dependent on the level of a first input signal.
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