Molded package and method of manufacture

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United States of America Patent

PATENT NO 10629456
SERIAL NO

15517725

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Abstract

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A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.

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Patent Owner(s)

  • KONINKLIJKE PHILIPS N.V.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Golubovic, Dusan Shanghai, CN 13 94
Huang, Yujie Shanghai, CN 7 1
Ku, Chengsheng Shanghai, CN 2 0
Lee, Yuhua Shanghai, CN 2 0
Liu, Chingming Shanghai, CN 2 0
Liu, Yun Shanghai, CN 224 731
Zhu, Mengming Shanghai, CN 2 0

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