Ball forming device for wire bonder

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United States of America Patent

PATENT NO 10629563
SERIAL NO

15533271

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A ball forming device includes a first current control circuit to control discharge current arranged between a leading end of a wire and one electrode of a discharge continuing power source for causing discharge current to flow after dielectric breakdown, a second current control circuit to control shunting of discharge current arranged between a discharge electrode and the other electrode of the discharge continuing power source, and a fixed resistor connected to the second current control circuit in parallel as a shunt and controls current flowing through the second current control circuit, thereby a discharge voltage value is adequately changed.

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Patent Owner(s)

Patent OwnerAddress
KAIJO CORPORATION3-1-5 SAKAE-CHO HAMURA-SHI TOKYO 205-8607

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sakurai, Yusuke Tokyo, JP 24 45

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