Grounding apparatus and methods for grounding
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United States of America Patent
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Apr 16, 2019
Grant Date -
Nov 16, 2017
app pub date -
May 7, 2017
filing date -
May 10, 2016
priority date (Note) -
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Abstract
A method for electrically grounding structures or equipment includes providing an open-topped enclosure having peripheral sidewalls defining an interior cavity, positioning the enclosure over an in situ soil mass, placing a selected soil material in the cavity, and installing a grounding device in the soil contained in the cavity, so as to establish electrically-conductive continuity between the grounding device and the soil material in the cavity, and between the soil material in the cavity and the underlying in situ soil mass. Electrical cables can then be run between the grounding device and a structure or equipment to effect electrical grounding thereof. The effectiveness of the resultant electrical grounding may be enhanced by moistening the soil material in the enclosure and/or the in situ soil mass. The enclosure may have an open bottom, or may have a floor element with apertures allowing passage of moisture.
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