LOW-WARPAGE CERAMIC CARRIER PLATE AND METHOD FOR PRODUCTION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 16, 2017
app pub date -
Dec 15, 2015
filing date -
Dec 16, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
For a carrier plate, it is proposed to brace a first ceramic functional layer over a connecting layer (VS) with a ceramic stressing layer (SPS) in order to reduce the lateral sintering shrinkage. The functional layer (FS) and the stressing layer (SPS) are glass-free or have only a small glass content of less than 5 wt %, whereas the connecting layer (VS) comprises a glass component or is a glass layer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully